Wafer bonding, or chip and wafer bonding, typically refers to a technology that utilizes different physical or chemical mechanisms to combine two or more wafers (homogeneous/heterogeneous) to achie...
In fact, as early as March this year, many media outlets reported that among memory chips, only HBM may continue to rise in price, while others may not see much further increase.At that time, many ...
According to a news report from Kuaijike on May 28, the China Information Security Evaluation Center and the National Confidential Technology Evaluation Center recently jointly announced that 9 dom...
A Q1 2026 Data Point Throws Cold Water on the AI Chip TrackA piece of data from Q1 2026 has thrown cold water on the AI chip sector.Globally, 135 companies are engaged in AI processor development, ...
In April 2026, the most buzzing event in China's semiconductor industry was not the launch of any particular chip, but rather the news that a company, which had been suffering losses for three ...
Let me ask you a question: Would you be willing to wear a pair of AI glasses? Do you believe that AI glasses will replace mobile phones in a few years?By the end of 2025, when we look back at the A...
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